HyzocoolDATA CENTER SOLUTIONS
English
中文EnglishSuomiFrançaisDeutsch日本語한국어PolskiPortuguêsРусскийEspañol
HYZOCOOL

PCIe, MCIO, OCuLink & Server Cooling Guides

Technical guides for PCIe Gen5/6, MCIO, OCuLink, EDSFF, NVMe cabling, 1U–4U server cooling and AI liquid cooling.

Hyzocool data center hardware
Data center hardware technical article
TECHNICAL INSIGHT

PCIe Gen5 to Gen6: What Changes in Real Hardware?

Signal integrity, materials, routing and connector choices become increasingly critical as link speeds rise.

Read article →
Data center hardware technical article
TECHNICAL INSIGHT

MCIO vs OCuLink for Modern Server Platforms

A practical overview of where each interface fits in storage, GPU, riser and internal server architectures.

Read article →
Data center hardware technical article
TECHNICAL INSIGHT

1U, 2U and 4U Server Cooling: Design Trade-offs

Airflow, fin density, fan pressure, vapor chambers and cold plates behave very differently across server heights.

Read article →
Data center hardware technical article
TECHNICAL INSIGHT

Air Cooling vs Liquid Cooling for AI Servers

When power density rises, the right cooling architecture depends on heat load, serviceability, acoustics and infrastructure.

Read article →