HYZOCOOL

PCIe Gen5/6 Interconnect & Server Cooling Solutions

Engineering support for PCIe Gen5/6 interconnects, signal integrity, NVMe storage cabling and 1U–4U server air or liquid cooling.

01 · INTERCONNECT

High-Speed Interconnect

External high-speed interconnects: DAC, ACC, AOC and MPO for switches, NICs and high-bandwidth data-centre links.
Internal high-speed interconnects: OCuLink, MCIO and EDSFF for PCIe Gen4/5/6 connectivity and stable signal integrity inside servers.

DAC / ACC / AOC / MPOOCuLink / MCIO / EDSFFPCIe Gen4 / Gen5 / Gen6Signal Integrity

02 · THERMAL

Thermal Management

Passive and active air cooling, vapor chambers, heat pipes and liquid cold plates for Intel, AMD, Ampere and customized server platforms.

1U / 2U / 4UHeat PipeVapor ChamberCold PlateCustom Mechanics

03 · OEM / ODM

Custom Engineering

Connector selection, cable length, mechanical constraints, airflow, thermal targets and manufacturability can be optimized together for the target platform.