DATA CENTER SOLUTIONSMCIO, OCuLink and EDSFF cables, PCIe Gen5 adapter cards, and 1U–4U air or liquid cooling for AI, HPC, storage and data-center servers.
External high-speed interconnects: DAC, ACC, AOC and MPO for switches, NICs and high-bandwidth data-centre links.
Internal high-speed interconnects: OCuLink, MCIO and EDSFF for PCIe Gen4/5/6 connectivity and stable signal integrity inside servers.
Passive and active air cooling, vapor chambers, heat pipes and liquid cold plates for Intel, AMD, Ampere and customized server platforms.
Learn more →Products, engineering and supply-chain execution in one solution stack.
Server and data-center hardware organized by application: PCIe expansion, internal and external interconnects, air cooling and liquid cooling.
PCIe Gen5 x16 → 4× M.2Industrial PCIe Gen5 x16 to 4× M.2 low-profile adapter for 2U chassis, with a thermally optimised design. Four M.2 SSDs are detected when the motherboard supports PCIe bifurcation.
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DAC / ACC / AOC / MPO
MCIO / OCuLink / EDSFFInternal server high-speed interconnect cables for PCIe Gen4/5/6.
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1U / 2U / 4UHeat pipe, vapor chamber, brazed and die-cast thermal solutions, including aluminium-extrusion heatsink solutions.
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1U / 2U / 4USide-flow and down-flow active heatsinks for dense server platforms.
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Cold Plate / Liquid CoolingCold-plate solutions for high-power CPUs, GPUs and accelerators.
Request specification →Evergreen technical content around PCIe, high-speed interconnects, server cooling and data-center hardware.
Signal integrity, materials, routing and connector choices become increasingly critical as link speeds rise.
Read article →A practical overview of where each interface fits in storage, GPU, riser and internal server architectures.
Read article →Airflow, fin density, fan pressure, vapor chambers and cold plates behave very differently across server heights.
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When power density rises, the right cooling architecture depends on heat load, serviceability, acoustics and infrastructure.
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